Abaco Systems / SBS / Greenspring IP-ADIO Analog and Digital I/O IndustryPack

The IP-ADIO is an IndustryPack mezzanine module that delivers integrated analog and digital input/output capabilities for embedded systems requiring high-density signal processing. Conforming to the VITA IndustryPack specification (ANSI/VITA 4-1995), it mounts on carrier cards across multiple bus architectures to enable flexible, scalable I/O expansion without redesigning host hardware.

Technical Specifications

• Single-wide IndustryPack module compatible with Type I and Type II specifications


• Supports 8 MHz or 32 MHz operation; carrier boards may transparently convert 32-bit accesses to 16-bit for the module Analog I/O


• Analog-to-digital and digital-to-analog conversion capabilities


• Resolution and channel configurations vary by module variant (12-bit, 14-bit, or 16-bit options; 16 differential or 32 single-ended channel options available) Digital I/O


• Configurable from 8 to 64 bits depending on variant


• Signal types include buffered TTL, optically isolated inputs/outputs, and 24V rated lines


• Interface standards supported: RS232, RS485, RS422, and others per module configuration Power


• Powered from host carrier board supply (typically +12V primary, +3.3V auxiliary per carrier specifications)

Key Features

• Compact mezzanine form factor enables multiple modules per carrier for maximum I/O density


• VITA-standardized interface ensures cross-manufacturer compatibility


• No redesign of host system required - leverages existing carrier infrastructure


• Module-level configuration allows mixed analog/digital topologies on single carrier

Typical Applications Embedded data acquisition, industrial process control, test & measurement systems, and field-mounted I/O expansion in space-constrained enclosures.

Compatibility & Integration Works with IndustryPack carrier cards supporting VME, PCI, CompactPCI, PCI Express, ISA, STD32, and PC/104 bus architectures. Full VITA 4-1995 compliance guarantees interoperability across vendor ecosystems.