Agilent/Keysight E9301B

The Keysight E9301B is a diode-based average power sensor engineered for precise power measurement across RF and microwave frequencies. It integrates with Keysight power meters to deliver accurate readings across all modulation formats, making it ideal for wireless communications, radar, and device testing applications. The sensor spans 10 MHz to 6 GHz with a 74 dB dynamic range and maximum input of +44 dBm (25 W).

Dual independent measurement paths - one optimized for high power (+20 dBm to +44 dBm) and one for low power (−30 dBm to +20 dBm) - ensure measurement fidelity across its full range. Internal EEPROM stores calibration factors, linearity data, and temperature compensation coefficients to maintain accuracy throughout the sensor's operating envelope. Low SWR design minimizes mismatch uncertainty.

Technical Specifications

• Sensor Type: Diode power sensor


• Measurement Type: Average power


• Frequency Range: 10 MHz to 6 GHz


• Power Range: −30 dBm to +44 dBm


• Maximum Input Power: +44 dBm (25 W)


• Dynamic Range: 74 dB


• High Power Path: +20 dBm to +44 dBm


• Low Power Path: −30 dBm to +20 dBm

Key Features

• Dual independent measurement paths for optimized performance across full dynamic range


• Low SWR design reduces mismatch uncertainty


• Measures average power for all modulation formats without special calibration


• Internal EEPROM stores calibration factors, linearity, and temperature compensation data


• Wide 74 dB dynamic range in a compact form factor

Typical Applications

• Wireless communications power verification


• Radar system testing and validation


• RF and microwave device characterization


• Modulated signal power measurement across diverse formats

Compatibility & Integration The E9301B interfaces with Keysight EPM Series meters (N1913B/14B, N1913A/14A, E4418B/19B), EPM-P Series (E4416A/17A), and P-Series (N1911A/12A) instruments. Complete documentation includes product datasheets, operating and service guides, 2D mechanical drawings in PDF, and 3D models in STEP format.