Curtiss-Wright / DY-4 SVME-177 Single VME Module Computer

The Curtiss-Wright/DY-4 SVME-177 is a ruggedized single VMEbus module computer that consolidates processor, memory, and multi-protocol I/O onto one board for demanding embedded defense, aerospace, and industrial applications. Built around a PowerPC 603e RISC CPU operating at 100 MHz, it delivers integrated computing capability without requiring stacked modules.

Technical Specifications Processing & Memory

PowerPC 603e RISC CPU at 100 MHz

Up to 64 Mbytes DRAM with Error Detection and Correction (EDAC)

8 Mbytes 64-bit Flash EPROM for applications

2 Mbytes boot Flash EPROM

256 Kbytes EEPROM

512 bytes serial EEPROM for configuration storage

Burst performance: 5.3/3.3 Mbytes/second (EDAC off); 6.4/4.4 Mbytes/second (EDAC on) VMEbus Interface

A32:D32 VMEbus with A64:D64 MBLT support (ANSI/VITA 1-1994, VME64)

Advanced VME Interface Chip (SCV64) with location monitor and FIFO buffer

Bus Isolation mode (BI-mode®), Auto-ID, and Auto-SYSCON capabilities

System controller functions On-Board Communications

Ethernet (AUI interface)

SCSI-2 single-ended, 8-bit wide: 5 Mbytes/second asynchronous or 10 Mbytes/second synchronous

Two EIA-422 serial channels: 75 to 38.4K bps asynchronous; 613K bps synchronous (1M bps with DMA)

Two EIA-423 serial channels: 75 to 38.4K bps programmable rates

Four 16-bit counter/timers

Key Features

Conduction-cooled per IEEE 1101.2 (0.80-inch pitch) for MIL-E-5400/4158 environments

95% fault coverage Built-In-Test (BIT) with results stored in RAM

MAXPack mezzanine expansion support for flexible I/O enhancement

Programmable low-power operating modes

Foundation firmware: debug monitor, diagnostics, Card Support Services, Execution Sequencer, Non-Volatile Memory Programmer, and FlashProg in-circuit programming utility

Typical Applications Defense systems, airborne platforms, and industrial control environments requiring integrated computing and multi-interface connectivity on a single VME module.

Compatibility & Integration DRAM accessible from CPU, VMEbus, SCSI, Ethernet, and MAXPack interface. Compatible with both air-cooled and conduction-cooled baseboards.